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TRUMPF makes glass substrates ready for the next generation of AI chips

The Sun Malaysia 01 Sep

Malaysia

TRUMPF makes glass substrates ready for the next generation of AI chips — Sumber: The Sun Malaysia

The future of AI chips is increasingly being shaped by packaging // With its HiPIMS product line, TRUMPF is addressing a key challenge facing the semiconductor industry: the reliable coating of highly complex glass substrates for the next generation of high-performance AI processors. DITZINGEN, GERMANY / TAIPEI, TAIWAN – Media OutReach Newswire – 1 September […]

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